Linear Integrated Circuit Questions and Answers – Fabrication of FET

This set of Linear Integrated Circuit Multiple Choice Questions & Answers (MCQs) focuses on “Fabrication of FET”. 1. JFET is similar to that of fabrication of a) Diode fabrication b) BJT fabrication c) FET fabrication d) None of the mentioned 2. What are the types of MOSFET devices available? a) P-type enhancement type MOSFET b) … Read more

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Linear Integrated Circuit Questions and Answers – Thin Film and Thick Film Technology

This set of Linear Integrated Circuit Multiple Choice Questions & Answers (MCQs) focuses on “Thin Film and Thick Film Technology”. 1. When does an integrated circuit exhibit greater degree of freedom and electrical performance? a) In thin and thick film technology b) In semiconductor technology c) In semiconductor and films technology d) In thick film … Read more

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Linear Integrated Circuit Questions and Answers – Active and Passive Components of IC – 3

This set of Linear Integrated Circuit MCQs focuses on “Active and Passive Components of IC – 3”. 1. Find the epitaxial resistor from the given cross-sectional view diagram? a) b) c) d) 2. Which integrated resistor can achieve high value of sheet resistance? a) Pinched resistor b) Epitaxial resistor c) Thin film resistor d) All … Read more

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Linear Integrated Circuit Questions and Answers – Active and Passive Components of IC – 2

This set of Linear Integrated Circuit Quiz focuses on “Active and Passive Components of IC – 2”. 1. The number of leads in schottky barrier diode are a) Four b) Three c) Two d) Six 2. In Schottky barrier diode, which contact has similar characteristics to that of an ordinary PN diode? a) Ohmic contact … Read more

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Linear Integrated Circuit Questions and Answers – Active and Passive Components of IC – 1

This set of Linear Integrated Circuit Multiple Choice Questions & Answers (MCQs) focuses on “Active and Passive Components of IC – 1”. 1. Which is the most striking feature in monolithic integrated circuit transistor? a) Collector contact is present at the bottom of IC b) Collector contact is present at the top of IC c) … Read more

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Linear Integrated Circuit Questions and Answers – Basic Planar Process – 3

This set of Linear Integrated Circuit test focuses on “Basic Planar Process – 3”. 1. The major disadvantage of PN-junction isolation technique is: a) Formation of Parasitic Resistance b) Formation of Parasitic Capacitance c) Formation of Isolation island d) None of the mentioned 2. Which isolation technique is used in applications like military and aeroscope? … Read more

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Linear Integrated Circuit Questions and Answers – Basic Planar Process – 2

This set of Linear Integrated Circuit Interview Questions and Answers for Experienced people focuses on “Basic Planar Process – 2”. 1. The process involved in photolithography is a) Making of a photographic mask only b) Photo etching c) Both photo etching and making of photographic mask d) None of the mentioned 2. How will be … Read more

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Linear Integrated Circuit Questions and Answers – Basic Planar Process – 1

This set of Linear Integrated Circuit Multiple Choice Questions & Answers (MCQs) focuses on “Basic Planar Process – 1”. 1. Find the basic chemical reaction used for Epitaxial growth? a) Sic4 + 4H Si + 4Hcl b) Sic2 + H2 Si + 2Hcl c) Sic4 + H2 Si + 4Hcl d) 2Sic2 + 2H2 4Si … Read more

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Linear Integrated Circuit Questions and Answers – IC Chip Size and Circuit Complexity

This set of Linear Integrated Circuit Multiple Choice Questions & Answers (MCQs) focuses on “IC Chip Size and Circuit Complexity”. 1. How many gates per chip are used in first generation Integrated Circuits? a) 3-30 b) 30-300 c) 300-3000 d) More than 3000 2. Find the chip area for a Medium Scale Integration IC? a) … Read more

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Linear Integrated Circuit Questions and Answers – Integrated Circuits, Types & Manufacturer’s Design – 2

This set of Linear Integrated Circuit Questions and Answers for Experienced people focuses on “Integrated Circuits, Types & Manufacturer’s Design – 2”. 1. Which package type is chosen for military purposes? a) Ceramic DIP b) Plat pack c) Metal can pack d) Plastic DIP 2. A Dual-In-Line Package is usually referred to as a) DIPn … Read more

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Manish Bhojasia - Founder & CTO at Sanfoundry
Manish Bhojasia, a technology veteran with 20+ years @ Cisco & Wipro, is Founder and CTO at Sanfoundry. He lives in Bangalore, and focuses on development of Linux Kernel, SAN Technologies, Advanced C, Data Structures & Alogrithms. Stay connected with him at LinkedIn.

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