# Linear Integrated Circuit Questions and Answers – Thin Film and Thick Film Technology

This set of Linear Integrated Circuit Multiple Choice Questions & Answers (MCQs) focuses on “Thin Film and Thick Film Technology”.

1. When does an integrated circuit exhibit greater degree of freedom and electrical performance?
a) In thin and thick film technology
b) In semiconductor technology
c) In semiconductor and films technology
d) In thick film technology only

Explanation: Combining films and semiconductor technology provide a better electrical performance than either technology can provide separately.

2. Give the thickness range of the film used in thin film technology
a) 0.5-2.5 mils
b) 0.02-8 mils
c) 10-20 mils
d) 0.05-0.0 7mils

Explanation: Thin films have thickness varying from 50 Å to 20,000 Å.
W.k.t, 1 Å=0.4 µmil,
=>50 Å=50 × 0.4µmil=0.02 mmil,
=>20,000 Å=20, 000*0.4µmil=8 mmil,
=>therefore, the thickness range from 0.02-8 mmil.

3. Which technology is used to get cheap resistors and capacitors?
a) Thick film technology
b) Thin film technology
c) Thin and thick film technology
d) None of the mentioned

Explanation: Thick film technology produces cheap and rugged components, whereas thin film technology provides greater precision in manufacturing but is quite expensive. The processing equipment for thick film circuit is relatively inexpensive and is easy to use.

4. How is the process of film deposition carried out in cathode sputtering?
a) Slower than evaporation method
b) Faster than evaporation method
c) Similar to same as evaporation method
d) All of the mentioned

Explanation: Cathode sputtering and vacuum evaporation uses identical system. However, the process of film deposition in cathode sputtering is slower than evaporation method. Since depositing a micron-thick film takes minutes to hours, compared to seconds to minutes for evaporation.

5. How a uniform film with good crystal structure is attained in cathode sputtering process?
a) By hitting high energy particle directly on the substrate
b) Allowing Less time for the particles to deposit on the substrate
c) High energy particle diffuse through low pressure gas and deposits on the substrate
d) Heavy inert gas is used for film deposition on the substrate

Explanation: The process of cathode sputtering is performed at a low pressure (about 10-12 torr). So, when the high energy particle landing on the substrate actually results in a very uniform film and adhesion.
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6. Which process is used to deposit metals on glass, ceramic and plastic?
a) Silk plating technique
b) Gas plating technique
c) Electroless plating technique
d) Electroplating technique

Explanation: In electroless plating, a metal ion in solution is reduced to the free metal and deposited as a metallic coating without the use of a coating without the use of an electric current. Thus, this process is used in plating on glass, ceramic and plastic.

7. Electroplating technique is suitable for
a) Making conduction films ceramic
b) Coating with considerable thickness
c) Coating without use of electric current
d) Making conduction films of gold or copper

Explanation: Electroplating is a process of coating an object with one or more layers of different metal. When dc is passed through the electrolytic solution, the positive metal ions migrate from anode (metal) and deposit on the cathode (substrate).

8. Which of the following process is involve in thick film technology
a) Screen printing
b) Ceramic firing
c) Silk screening
d) All of the mentioned

Explanation: Silk screening is one of the processes of thin film technology.

9. An ancient process used till today for production of circuit films is,
a) Silk Screening technique
b) Surface Mount Technology
c) Ceramic Printing technique
d) Screen Printing technique

Explanation: The process of screen printing pattern is an ancient one. The Egyptian used this technique thousands of years ago to decrease potter and wall of building.

10. What is the advantage of using Surface Mount Technology?
a) All of the mentioned
b) Low power consumption
c) Reduces heat dissipation in components

Explanation: Surface Mount Technology utilizes micro-miniature leaded or leadless components called Surface Mount Device (SMD) which are directly soldered to the specified areas on the surface without hole. Also, the compact size of SMDs reduces the area in PCB and increases the packing density.

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