Manufacturing Engineering Questions & Answers – Non-Destructive Testing

This set of Manufacturing Engineering Multiple Choice Questions & Answers (MCQs) focuses on “Non-Destructive Testing”. 1. What is first step involved in the process of preparing test sample for microstructural examination? a) Rough polishing b) Fine grinding c) Fine polishing d) Etching 2. Which of the following compound is used for fine polishing? a) Aluminum … Read more

advertisement

Manufacturing Engineering Questions & Answers – Mechanical Testing

This set of Manufacturing Engineering Multiple Choice Questions & Answers (MCQs) focuses on “Mechanical Testing”. 1. Hounsfield tensometer can be used to perform __________ a) Tensile test b) Compressive test c) Hardness test d) Toughness test 2. ASTM stands for __________ a) American Society for Tensile Measurement b) American Society for Testing and Materials c) … Read more

advertisement

Manufacturing Engineering Questions & Answers – Mechanical Properties

This set of Manufacturing Engineering Multiple Choice Questions & Answers (MCQs) focuses on “Mechanical Properties”. 1. Resistance of a material against any external force is termed as _______________ a) Stiffness b) Malleability c) Strength d) Hardness 2. The property of a material to resist any elastic deformation is termed as ____________ a) Stiffness b) Hardness … Read more

advertisement

Manufacturing Engineering Questions & Answers – Imperfection and Defects In Solid

This set of Manufacturing Engineering Multiple Choice Questions & Answers (MCQs) focuses on “Imperfection and Defects In Solid”. 1. Vacancy defects in solids is a sub type of __________ a) Point imperfections b) Line imperfections c) Volume imperfections d) Surface imperfections 2. Substitution of a foreign atom in the site of parent atom in the … Read more

advertisement

Manufacturing Engineering Questions & Answers – Miller Indices

This set of Manufacturing Engineering Multiple Choice Questions & Answers (MCQs) focuses on “Miller Indices”. 1. Stacking sequence in hexagonal close packed (HCP) structure is? a) AAAAA b) ABABAB c) ABCABC d) AABBAA 2. Stacking sequence in face centered cubic (FCC) close packed structure is? a) AAAAA b) ABABAB c) ABCABC d) AABBAA 3. For … Read more

advertisement

Manufacturing Engineering Questions & Answers – Crystallography-2

This set of Manufacturing Engineering Interview Questions and Answers focuses on “Crystallography-2”. 1. What is the coordination number of a simple cubic (SC) unit cell? a) 4 b) 6 c) 8 d) 2 2. What is the coordination number of a face centered cubic (FCC) unit cell? a) 4 b) 6 c) 8 d) 12 … Read more

advertisement

Manufacturing Engineering Questions & Answers – Crystallography-1

This set of Manufacturing Engineering Multiple Choice Questions & Answers (MCQs) focuses on “Crystallography-1”. 1. Which of the following has a non-crystalline structure? a) Iron b) Quartz c) Silica glass d) Tungsten 2. Which of the following has less crystallinity? a) Iron b) Nickel c) High density polythene d) Low density polythene 3. Which of … Read more

advertisement
Subscribe to our Newsletters (Subject-wise). Participate in the Sanfoundry Certification contest to get free Certificate of Merit. Join our social networks below and stay updated with latest contests, videos, internships and jobs!

Youtube | Telegram | LinkedIn | Instagram | Facebook | Twitter | Pinterest
Manish Bhojasia - Founder & CTO at Sanfoundry
Manish Bhojasia, a technology veteran with 20+ years @ Cisco & Wipro, is Founder and CTO at Sanfoundry. He lives in Bangalore, and focuses on development of Linux Kernel, SAN Technologies, Advanced C, Data Structures & Alogrithms. Stay connected with him at LinkedIn.

Subscribe to his free Masterclasses at Youtube & discussions at Telegram SanfoundryClasses.