Best Reference Books – Electronic Manufacturing Assembly and Packaging

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We have compiled the list of Top 10 Best Reference Books on Electronic Manufacturing Assembly and Packaging subject. These books are used by students of top universities, institutes and colleges. Here is the full list of top 10 best books on Electronic Manufacturing Assembly and Packaging along with reviews.

Kindly note that we have put a lot of effort into researching the best books on Electronic Manufacturing Assembly and Packaging subject and came out with a recommended list of top 10 best books. The table below contains the Name of these best books, their authors, publishers and an unbiased review of books on "Electronic Manufacturing Assembly and Packaging" as well as links to the Amazon website to directly purchase these books. As an Amazon Associate, we earn from qualifying purchases, but this does not impact our reviews, comparisons, and listing of these top books; the table serves as a ready reckoner list of these best books.

1. “The Electronics Assembly Handbook” by Frank Riley and Electronic Packaging and Production

“The Electronics Assembly Handbook” Book Review: Handbook for assembly engineering and electronic packaging and production. The book contains information on multi layer boards, chip-on-board and numerous case studies. It is a book for areas of robotics and automated assembly. It also contains current manufacturing practices.

2. “Manufacturing Challenges in Electronic Packaging” by Y C Lee and W T Chen

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“Manufacturing Challenges in Electronic Packaging” Book Review: The book contains reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The book starts with manufacturing challenges in electronic packaging based on trends predicted by different resources. It also lists efforts to implement these technologies for mass production or flexible manufacturing. It’s contents include challenges in solder assembly technologies, testing and characterization, design for manufacture and assembly of electronic packages, etc. Also it has some advanced topics like integrated manufacturing systems for printed circuit board assembly and process modeling, optimization and control in electronics manufacturing. Book for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

3. “Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly” by Jennie S Hwang

“Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly” Book Review: The book contains solutions for the utilization of surface mount technology as a replacement for through-hole technology. It also lists advantages of mounting electronic devices and components onto the surface of a printed wiring board over inserting the leads of devices or components into holes. The book covers from the application of automated assembly and robotics to high lead count surface mounted devices and components. It also lists most practical soldering methods whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. It also has chemical, metallurgical and rheological principles for the successful use of solder pastes. It also covers important areas of solder paste technology.

4. “Surface Mount Technology: Principles and Practice” by Ray P Prasad

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“Surface Mount Technology: Principles and Practice” Book Review: Book about packaging technology to produce state-of-the-art miniaturized electronic products. It is a book for managers who need to manage the risk during its implementation, who need to improve the design and manufacturing processes for improved yield and cost reduction. It covers basic principles and practice of the surface mount technology.

5. “Area Array Packaging Handbook: Manufacturing and Assembly (Electronic Packaging and Interconnection)” by Ken Gilleo

“Area Array Packaging Handbook: Manufacturing and Assembly (Electronic Packaging and Interconnection)” Book Review: The book covers areas of BGA, CSP, flip chip and microelectronics packaging. It also has teaching design, application and manufacturing how-tos. Also it has the latest technologies in electronics packaging – BGA, CSP, flip chips and details on MEMs technology. The book also lists pros and cons of each technology in various applications, solutions for difficult packaging ramifications of HDI design concepts, detailed coverage of critical reliability and testing issues and problem-solving approaches to conception, construction, assembly and applications.

6. “Lead–Free Electronics: iNEMI Projects Lead to Successful Manufacturing” by Edwin Bradley and Carol A Handwerker

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“Lead–Free Electronics: iNEMI Projects Lead to Successful Manufacturing” Book Review: Book contains issues surrounding the implementation of Pb-free solder into electronic board assembly. It also covers results from the thirty company NEMI project activities. Resources for engineers and companies faced with making the switch to Pb-free solder assembly. It also lists changes to come over to Pb free soldering. It also covers analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb.

7. “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)” by Karl J Puttlitz and Kathleen A Stalter

“Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)” Book Review: The book provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. It also has general reliability issues concerning microelectronic assemblies. As well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. The book introduces reduced-lead and lead-free technology. It also discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

8. “Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing” by Sheng Liu and Yong Liu

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“Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing” Book Review: The book discusses the modeling and simulation as necessary aspects for future advances in 3D package development. It also covers basic and advanced modeling and simulation skills to help solve problems. It also provides the skills necessary for virtual prototyping and virtual reliability qualification and testing. Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products. Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects. It also discusses how the assembly manufacturing, reliability and testing will impact their products.

9. “Integrated Circuit Packaging, Assembly and Interconnections” by William Greig

“Integrated Circuit Packaging, Assembly and Interconnections” Book Review: This book reviews various IC packaging, assembly and interconnection technologies. It also provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and reliability concerns with the various technologies applicable to packaging and assembly of the IC. It also covers various packaging approaches, assembly options and essential manufacturing technologies.

10. “Microelectronic Interconnections and Assembly (Nato Science Partnership Subseries: 3)” by G G Harman and Pavel Mach

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“Microelectronic Interconnections and Assembly (Nato Science Partnership Subseries: 3)” Book Review: The book discusses technical aspects of advanced interconnections and microassembly. It also covers technical aspects of advanced interconnections and microassembly as well as overviews predicting the future directions of these technologies. It also discusses basic issues with electronic systems and how to improve time performance. It also has the newest chip packages with an appropriate interconnection method. The book also included papers on the education issues to work in microelectronic areas.

People who are searching for Free downloads of books and free pdf copies of these top 10 books on Electronic Manufacturing Assembly and Packaging – we would like to mention that we don’t have free downloadable pdf copies of these good books and one should look for free pdf copies from these Authors only if they have explicitly made it free to download and read them.

We have created a collection of best reference books on "Electronic Manufacturing Assembly and Packaging" so that one can readily see the list of top books on "Electronic Manufacturing Assembly and Packaging" and buy the books either online or offline.

If any more book needs to be added to the list of best books on Electronic Manufacturing Assembly and Packaging subject, please let us know.

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Manish Bhojasia, a technology veteran with 20+ years @ Cisco & Wipro, is Founder and CTO at Sanfoundry. He is Linux Kernel Developer & SAN Architect and is passionate about competency developments in these areas. He lives in Bangalore and delivers focused training sessions to IT professionals in Linux Kernel, Linux Debugging, Linux Device Drivers, Linux Networking, Linux Storage, Advanced C Programming, SAN Storage Technologies, SCSI Internals & Storage Protocols such as iSCSI & Fiber Channel. Stay connected with him @ LinkedIn | Youtube | Instagram | Facebook | Twitter