Manufacturing Engineering Questions & Answers – Grinding Wheel-3

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This set of Basic Manufacturing Engineering Questions & Answers focuses on “Grinding Wheel-3”.

1. Which of the following will be better to use for machining of soft work piece?
a) V-bond
b) R-bond
c) Both V and R bond
d) None of the mentioned
View Answer

Answer: b
Explanation: Rubber bond grinding wheel is generally used for machining of soft work piece. Fifth place of ISO designation of grinding wheel represents type of bond.

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2. Which of the following grinding wheel would be more economical for grinding of hard work piece?
a) Soft grinding wheel
b) Hard grinding wheel
c) Both hard and soft grinding wheel
d) None of the mentioned
View Answer

Answer: a
Explanation: In soft grinding wheels, during machining of hard work piece glazing will occur after long time.

3. Which of the following grinding wheel would be more economical for grinding of soft work piece?
a) Soft grinding wheel
b) Hard grinding wheel
c) Both hard and soft grinding wheel
d) None of the mentioned
View Answer

Answer: b
Explanation: In hard grinding wheels, during machining of soft work piece glazing will occur after long time and grains of grinding wheel will be effectively utilized before coming out from the wheel.
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4. Which of the following grinding wheel would be more economical for grinding of hard work piece?
a) Open structure grinding wheel
b) Dense structure wheel
c) Both dense and open structure grinding wheel
d) None of the mentioned
View Answer

Answer: b
Explanation: In dense structure grinding wheels, during machining of hard work piece material removal rate is small and also wheel has good strength.

5. Which of the following grinding wheel would be more economical for grinding of soft work piece?
a) Open structure grinding wheel
b) Dense structure wheel
c) Both dense and open structure grinding wheel
d) None of the mentioned
View Answer

Answer: a
Explanation: In open structure grinding wheels, during machining of soft work piece material removal rate is large and space for chip flow is also large due to more space between grains of wheel.
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6. Material removal rate of grinding process in comparison to material removal rate in facing on a lathe is
a) Small
b) Large
c) Same
d) Can’t say about material removal rate
View Answer

Answer: a
Explanation: Material removal rate in grinding process is very small. Hence grinding is mostly use as a finishing process. Only small portion of abrasives are involved in grinding process and hence has less material removal rate.

7. Material removal rate in grinding operation is small due to
a) Negative rake angle
b) Positive rake angle
c) Zero rake angle
d) Material removal rate does not depend on the rake angle
View Answer

Answer: a
Explanation: Grinding wheel have negative rake angle and hence have very small material removal rate. Hence grinding is mostly use as a finishing process.
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8. Material removal rate in grinding operation is small due to
a) Only small portion of abrasives are involved in cutting
b) Positive rake angle
c) Zero rake angle
d) Material removal rate does not depend on the rake angle
View Answer

Answer: a
Explanation: Only small portion of abrasives are involved in grinding process and hence has less material removal rate. Hence grinding is mostly use as a finishing process.

9. Material removal rate in grinding operation is small due to
a) Large portion of abrasives are involved in cutting
b) Positive rake angle
c) Due to temperature rise during grinding
d) Material removal rate does not depend on the rake angle
View Answer

Answer: c
Explanation: Due to the increase in temperature during grinding operation some material get welded again with the chip.
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10. Grinding ratio generally lies between
a) 0.5-10
b) 100-200
c) 1000-200
d) 30-40
View Answer

Answer: a
Explanation: Grinding ratio = (volume of material removed/volume of wheel wear). G.R is generally between 0.5-10.

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Manish Bhojasia - Founder & CTO at Sanfoundry
Manish Bhojasia, a technology veteran with 20+ years @ Cisco & Wipro, is Founder and CTO at Sanfoundry. He is Linux Kernel Developer & SAN Architect and is passionate about competency developments in these areas. He lives in Bangalore and delivers focused training sessions to IT professionals in Linux Kernel, Linux Debugging, Linux Device Drivers, Linux Networking, Linux Storage, Advanced C Programming, SAN Storage Technologies, SCSI Internals & Storage Protocols such as iSCSI & Fiber Channel. Stay connected with him @ LinkedIn | Youtube | Instagram | Facebook | Twitter